Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering(English, Hardcover, Seok Seonho) Offer
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3999
- Language: English
- Binding: Hardcover
- Publisher: Springer International Publishing AG
- Genre: Technology & Engineering
- ISBN: 9783319778716, 9783319778716
- Pages: 115
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Features & Specifications stand apart in the TGMT : Testing of materials category. The details about Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering(English, Hardcover, Seok Seonho) are given below as well. Unboxing Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering specs Language: English, Binding: Hardcover, Publisher: Springer International Publishing AG, Genre: Technology & Engineering, ISBN: 9783319778716, 9783319778716, Pages: 115, & more details are given below
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Specs
Book Details
| Title | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |
| Imprint | Springer International Publishing AG |
| Product Form | Hardcover |
| Publisher | Springer International Publishing AG |
| Source ISBN | 9783319778716 |
| Genre | Technology & Engineering |
| ISBN13 | 9783319778716 |
| Book Category | Higher Education and Professional Books |
| BISAC Subject Heading | TEC020000 |
| Book Subcategory | Applied Sciences and Other Technologies Books |
| ISBN10 | 9783319778716 |
| Language | English |
Dimensions
| Height | 235 mm |
| Length | 155 mm |
| Weight | 454 gr |
Books Info
| Language | English |
| Binding | Hardcover |
| Pages | 115 |
| Publisher | Springer International Publishing AG |
| Year | 0 |
| Author | Seok Seonho |
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