Materials Science of Microelectromechanical Systems (MEMS) Devices III: Volume 657(English, Hardcover, unknown) Offer
Lowest Price
2295
- Language: English
- Binding: Hardcover
- Publisher: Materials Research Society
- Genre: Technology & Engineering
- ISBN: 9781558995673, 9781558995673
- Pages: 368
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Materials Science of Microelectromechanical Systems Devices III: Volume 657 Features & Specifications stand apart in the TGM : Materials science category. The details about Materials Science of Microelectromechanical Systems (MEMS) Devices III: Volume 657(English, Hardcover, unknown) are given below as well. Unboxing Materials Science of Microelectromechanical Systems Devices III: Volume 657 specs Language: English, Binding: Hardcover, Publisher: Materials Research Society, Genre: Technology & Engineering, ISBN: 9781558995673, 9781558995673, Pages: 368, & more details are given below
Microelectromechanical systems (MEMS) is a growing field with numerous potential commercial applications, including pressure and inertial sensing, optical and electrical switching, power conversion, fluidic flow control, and chemical analysis. MEMS combine mechanical and electrical (and sometimes optical, chemical, or biological) function at small scales using many of the batch fabrication techniques developed for the micro-electronics industry. Materials have been developed or adapted for MEMS applications for use as structures, actuators, and sensors. Processing techniques also have been established for integrating these materials with existing MEMS. In addition, MEMS technology has proven ideal for allowing the mechanical and tribological characterization of materials at small scales. This book, first published in 2001, addresses these issues and a variety of materials are discussed, including Si, porous Si, SiC, SiGe, diamond, electroplated Ni and Cu, as well as piezoelectric, ferroelectric, and shape memory materials, and self-assembled organic monolayers. Fabrication processes include plasma and chemical etching, Si bonding, high-aspect-ratio lithography and micromolding. In addition, the stress, fracture strength, fatigue, and friction of MEMS materials and structures are also discussed.
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Materials Science of Microelectromechanical Systems Devices III: Volume 657 Specs
Dimensions
| Width | 21 mm |
| Height | 229 mm |
| Length | 152 mm |
| Weight | 660 gr |
Series & Set Details
| Series Name | MRS Proceedings |
Book Details
| Title | Materials Science of Microelectromechanical Systems (MEMS) Devices III: Volume 657 |
| Imprint | Materials Research Society |
| Product Form | Hardcover |
| Publisher | Materials Research Society |
| Genre | Technology & Engineering |
| Source Type | T |
| ISBN13 | 9781558995673 |
| Book Category | Higher Education and Professional Books |
| BISAC Subject Heading | TEC021000 |
| Book Subcategory | Mechanical Engineering and Material Books |
| ISBN10 | 9781558995673 |
| Language | English |
Books Info
| Language | English |
| Binding | Hardcover |
| Pages | 368 |
| Publisher | Materials Research Society |
| Year | 0 |
| Author | unknown |
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