Materials Science of Microelectromechanical Systems (MEMS) Devices III: Volume 657(English, Hardcover, unknown) Offer

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  • Language: English
  • Binding: Hardcover
  • Publisher: Materials Research Society
  • Genre: Technology & Engineering
  • ISBN: 9781558995673, 9781558995673
  • Pages: 368
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Materials Science of Microelectromechanical Systems Devices III: Volume 657 Specifications

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Materials Science of Microelectromechanical Systems Devices III: Volume 657 Features & Specifications stand apart in the TGM : Materials science category. The details about Materials Science of Microelectromechanical Systems (MEMS) Devices III: Volume 657(English, Hardcover, unknown) are given below as well. Unboxing Materials Science of Microelectromechanical Systems Devices III: Volume 657 specs Language: English, Binding: Hardcover, Publisher: Materials Research Society, Genre: Technology & Engineering, ISBN: 9781558995673, 9781558995673, Pages: 368, & more details are given below

Microelectromechanical systems (MEMS) is a growing field with numerous potential commercial applications, including pressure and inertial sensing, optical and electrical switching, power conversion, fluidic flow control, and chemical analysis. MEMS combine mechanical and electrical (and sometimes optical, chemical, or biological) function at small scales using many of the batch fabrication techniques developed for the micro-electronics industry. Materials have been developed or adapted for MEMS applications for use as structures, actuators, and sensors. Processing techniques also have been established for integrating these materials with existing MEMS. In addition, MEMS technology has proven ideal for allowing the mechanical and tribological characterization of materials at small scales. This book, first published in 2001, addresses these issues and a variety of materials are discussed, including Si, porous Si, SiC, SiGe, diamond, electroplated Ni and Cu, as well as piezoelectric, ferroelectric, and shape memory materials, and self-assembled organic monolayers. Fabrication processes include plasma and chemical etching, Si bonding, high-aspect-ratio lithography and micromolding. In addition, the stress, fracture strength, fatigue, and friction of MEMS materials and structures are also discussed.

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Materials Science of Microelectromechanical Systems Devices III: Volume 657 Specs

Dimensions

Width 21 mm
Height 229 mm
Length 152 mm
Weight 660 gr

Series & Set Details

Series Name MRS Proceedings

Book Details

Title Materials Science of Microelectromechanical Systems (MEMS) Devices III: Volume 657
Imprint Materials Research Society
Product Form Hardcover
Publisher Materials Research Society
Genre Technology & Engineering
Source Type T
ISBN13 9781558995673
Book Category Higher Education and Professional Books
BISAC Subject Heading TEC021000
Book Subcategory Mechanical Engineering and Material Books
ISBN10 9781558995673
Language English

Books Info

Language English
Binding Hardcover
Pages 368
Publisher Materials Research Society
Year 0
Author unknown 

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